Intelligent Optical Wafer Surface Defect and Height Variation Inspection Equipment

SE-5AT2

Intelligent Optical Wafer Surface Defect and Height Variation Inspection Equipment

Provide accurate optical inspection and analysis for the defects generated in the semiconductor wafer manufacturing process. 
Apply the microscope auto focus module and the XYZ axis displacement platform (integrated optical scale) to perform flying trigger to capture the wafer surface image. 

The image comparison method and AI image deep learning method can be provided according to the defects that need to be detected, which can reduce the occurrence of overkill and underkill, automatically sort OK and NG parts with customized tolerances, calculate defect area, number of defects, and mark the defect location. It can also be integrated with automation to improve detection efficiency.

Advantages and Features

 → AI will determine the type, coordinates, and defect area on the wafer, and mark the number clearly to provide comprehensive and integrated data.

 → The thickness variation of the whole wafer is obtained by scanning the white light conjugate foci module.

 → It can be used with a white light conjugate foci module to measure the height variation of wafers/chips. 

 → This module has the advantages of high precision, and high-speed measurement and is not affected by the materials. 

 → The height in the result of height measurement is represented by a color distribution, the image presentation is intuitive, and the thickness measurement can also be performed by non-contact mode, including THK/TTV/WARP/BOW.

Measurement function